Semiconductor test

Memory and Semiconductor Test Equipment integrated circuits and reference designs


Our integrated circuits and reference designs help you create high accuracy testers at wafer, package and board levels enabling dense solutions for a high number of channels while minimizing channel-to-channel variation.

    Next generation semiconductor testers often require:

  • Highest levels of speed and accuracy through data acquisition channels
  • Tight temperature controls to minimize measurement drift
  • Precise reference voltage generation to improve measurement accuracy
  • Low jitter clock distribution to maximize SNR performance
  • Highly integrated, low-height power modules minimizing board-to-board spacing
View more

Technical documentation

Application notes & user guides

Application Notes (9)

Title Type Size (KB) Date
PDF 217 KB 11 Feb 2019
PDF 107 KB 31 Aug 2018
PDF 795 KB 20 Jul 2017
PDF 78 KB 14 Jun 2017
PDF 177 KB 03 Jan 2017
PDF 261 KB 17 May 2016
PDF 132 KB 16 Apr 2015
PDF 327 KB 10 Sep 2010
PDF 285 KB 28 Feb 2005

Product bulletin & white papers

White Papers (3)

Title Type Size (MB) Date
PDF 688 KB 01 Feb 2018
PDF 3.07 MB 01 Aug 2016
PDF 2.13 MB 31 Mar 2016

Technical articles

Support & training

Search our extensive online knowledge base where millions of technical questions and answers are available 24/7.

Search answers from TI experts

Content is provided 'AS IS' by the respective TI and Community contributors and does not constitute TI specifications.
See terms of use.

If you have questions about quality, packaging, or ordering TI products visit our Support page.